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The Differences in RF Semiconductor Materials and Their Advantages

Key Takeaways

  • RF semiconductors are used in the telecommunication, aerospace, automotive, and defense fields.

  • The range of circuits that employ RF semiconductor electronics is not limited to phase shifters, attenuators, couplers, filters, amplifiers, switches, oscillators, and antenna tuners.

  • RF semiconductor materials include gallium arsenide (GaAs), gallium nitride (GaN), silicon (Si), and silicon carbide (SiC).

Consumer electronics.

An increasing demand for consumer devices is one major factor supporting the growth of the RF semiconductor industry. RF semiconductors are used in the telecommunication, aerospace, automotive, and defense fields.

RF semiconductor materials include gallium arsenide (GaAs), gallium nitride (GaN), silicon (Si), and silicon carbide (SiC). These materials are significant in circuits such as RF filters, RF power amplifiers, RF low noise amplifiers, and RF switches. The differences in RF semiconductor materials cause variations in the speed and frequency characteristics of RF circuits, which is why it is critical for engineers to understand the differences in RF semiconductor materials.

The Increasing Popularity of RF Semiconductors

The RF semiconductor industry is fueled by LTE and advanced technologies such as 4G/5G. The considerable demand for wearable devices and smartphones have significantly boosted the turnover of RF semiconductor industries.

With the success of vehicle-to-vehicle and vehicle-to-infrastructure communication, new possibilities for RF semiconductors are being explored in the automotive field. Major players in the RF semiconductor markets have expanded their product portfolio after identifying the reach of RF devices in fields such as electronic warfare, radars, satellite communication, base stations, and transportation. Most of the big names in the RF semiconductor industry have invested billions in the research of new substrate materials, architectures, and packages by forecasting the monetary returns from present statistics. 

The Differences in RF Semiconductor Materials

The range of circuits that employ RF semiconductor electronics is not limited to phase shifters, attenuators, couplers, filters, amplifiers, switches, oscillators, antenna tuners, etc. The frequency band is so wide that RF semiconductor devices cover VHF, UHF, SHF, and EHF frequencies. To integrate advanced features, extend the operating temperatures, frequency, and speed, or to increase the performance or efficiency, a myriad of  RF semiconductor materials are introduced. Some of the RF semiconductors dominating the industry are given in the table below.

RF Semiconductor

Advantages

Silicon (Si)

  • Low cost
  • Ease of fabrication
  • High performance
  • Integration of digital and analog circuits in a single-chip utilizing CMOS technology is possible

Germanium (Ge)

  • Main application is as a resistive material in RF MEMS and high mobility channel devices 
  • High resistivity value
  • High refractive index and low optical dispersion

Silicon-Germanium (SiGe)

  • Wider gain bandwidth
  • Lower noise performance
  • Better power consumption and sensitivity

Gallium Nitride (GaN)

  • Wide bandgap material
  • High breakdown voltage
  • High power density
  • High operating frequency
  • High switching frequency
  • High efficiency
  • Excellent thermal conductivity

Gallium Arsenide (GaAs)

  • High electron mobility
  • High thermal stability
  • Low noise
  • Wide temperature operating range

Silicon Carbide (SiC)

  • Large bandgap energy
  • High electron mobility
  • High critical breakdown electric field
  • High thermal conductivity
  • High power density
  • High current density
  • Operating temperature above 150℃
  • High switching frequency
  • Low switching losses
  • 6H SiC and 4H SiC are the polytypes of SiC available

Indium Phosphide (InP)

  • High breakdown voltage
  • High thermal conductivity
  • High electron saturation velocity
  • High bandwidth
  • Suitable for ultra-fast transistors
 

Boron Nitride (BN)

  • Graphene is integrated with BN to achieve high electron mobility
  • High carrier velocity
  • High-frequency operation
  • Bo charge traps in BN substrate
 

Aluminium Nitride (AlN)

  • Excellent thermal conductivity
  • Thermal expansion match to silicon
  • Excellent resistance to wafer processing gases and plasma erosion
  • Dielectric loss can be modified

Piezoelectric substrate

  • High RF power handling capacity
  • Offers accurate resonant frequency for filter applications
  • Low insertion losses and high out of band rejection
  • Examples: LiNbO3, LiTaO3, ZnO

It is important to understand the differences in RF semiconductor materials to choose the appropriate material to fabricate RF devices. The careful selection of the semiconductor, architecture, and packaging has a direct influence on the performance of RF devices.

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