How to Use a Guard Ring in a PCB
Guard rings in a PCB are used to assist in EMI reduction, and they can be easily drawn into a PCB layout with copper pour and vias.
Read Article
-
-
CMOS Noise Margin Values
Power integrity and signal integrity design choices only work if they keep noise within the CMOS noise margin.
Read Article
-
Matching Thermal Measurements to Simulations
Thermal simulations for electronics in an enclosure need boundary conditions and source definitions based on temperature measurements.
Read Article
-
Power Supply Control Loop Transfer Function Construction
Power supply control loop transfer function can be determined from the output impedance of the power supply
Read Article
-
Healthcare Enterprise Modernizes Legacy Data Centers
A healthcare enterprise used Cadence® DataCenter Design Software and Insight Platform™ to modernize their legacy data centers, minimize stranded capacity, and overcome power, cooling, and space.
Read Article
-
Thésée DataCenter Are Providing Colocation Services Like No Other
Thésée DataCenter is providing a sovereign, eco-responsible colocation data center with the best level of security and availability at a competitive price.
Read Article
-
Colocation Data Center Success: High-Performance Computing and Energy Efficiency
Kao Data used Cadence® DataCenter Design Software™ to optimize their facility’s design and test numerous configurations to ensure resiliency.
Read Article
-
Tech Brief | Cadence DataCenter Insight Platform
Cadence DataCenter Insight Platform empowers IT and facilities management teams to collaborate on data center energy efficiency and performance optimization via a web-based portal when the data center
Read Article
-
Tech Brief | Cadence DataCenter Design Software
Cadence® DataCenter Design Software™ enables engineers to design the next generation of data centers, inside and out, with physics-based simulation software powered by computational fluid dynamics.
Read Article
-
Datasheet | DataCenter Insight Platform: Digital Twin Module
Cadence® DataCenter Design Software™ and DataCenter Insight Platform™ (formerly Future Facilities 6SigmaDCX product line) is a software platform for performance-aware design and operational planning.
Read Article
-
Datasheet | DataCenter Insight Platform: Asset Twin Module
Cadence® DataCenter Design Software™ and DataCenter Insight Platform™ (formerly Future Facilities 6SigmaDCX product line) is a software platform for performance-aware design and operational planning.
Read Article
-
How Selective Harmonic Elimination is Used in Circuits
Circuits with THD from fast switching pulses can restore signal quality with selective harmonic elimination.
Read Article
-
Embedded Systems With Generative AI Will Soon Be Real
Embedded systems can leverage generative AI capabilities as long as a dataset is available and processors can support.
Read Article
-
When to Use a Lookup Table in a Microcontroller
Micontrollers can store important data in a lookup table and use these for logical comparisons.
Read Article
-
The Concept of Portability in AI Apps and Hardware
AI has a portability problem, and that problem only gets bigger when you add custom hardware into the mix. Here’s how a modular hardware approach helps solve the problem.
Read Article
-
Group Delay Engineering in RF Filters
Signals that propagate through filters can experience varying group delay dispersion. Here's how it's engineered.
Read Article
-
Phase Delay vs. Group Delay: What's the Difference?
Phase delay and group delay are two related concepts that arise in high-speed PCBs and RF systems.
Read Article
-
What Simulations Are Needed for Chip Packaging?
Chip packaging evaluation can involve complex multiphysics simulations. Here are some of the main simulations needed in these systems.
Read Article
-
3 Ways to Extract DUT S-Parameters
S-parameters for a DUT can be isolated with de-embedding, electrical delay, or port extension using your VNA.
Read Article
-
What Could Cause a Solder Joint to Crack?
Solder joint cracking results from several possible causes, ranging from excess vibration to incorrect soldering of through-holes.
Read Article
-
Loading More...
