Overview of the IEEE IP-XACT Standard
Semiconductor IP can experience the same kind of seamless handoff as other forms of product data with the IEEE 1685 standard, known as the IP-XACT standard.
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MRP vs. ERP vs. PLM Software Usage in Electronics
MRP, ERP, and PLM systems are just a few of the enterprise management tools used by OEMs and electronics manufacturers.
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Glow Wire Testing for PCB Connectors
Glow wire testing is used in PCB connectors to ensure they can tolerate high currents that may lead to very high temperatures.
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Where PFAS Are Found in Your Electronics Assemblies
PFAS can be found in electronic components, cables, and circuit boards, as well as other portions of an electronics assembly.
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How Much Phase Noise is Acceptable in RF ADCs?
If you have a reference oscillator for an RF ADC, what is the level of phase noise you should accept on your oscillator?
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CXL 3.0 Builds Next-Gen Data Center Infrastructure
The enhancements in the new CXL 3.0 standard take advantage of the bandwidth increase in the PCIe 6.0 standard.
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When Should You Use a Power Module vs. PMIC?
Power regulator modules offer a compact alternative to power management ICs (PMICs). See which is best for your system in this article.
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A Workflow For TinyML Development
Embedded AI on small microcontrollers demands a workflow that works within TinyML core concepts.
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How to Verify S-parameters For Crosstalk Waveforms
Crosstalk simulation results can be presented in the time domain or the frequency domain. Pulse responses and S-parameters can be used to verify crosstalk waveforms.
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How Defective Ground Structures Can Be Used in RF PCBs
RF transmission lines sometimes need defective ground structures at the interface with components and connectors.
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SPICE or IBIS: Which Should You Use for High-Speed I/Os?
When you need to simulate high-speed interfaces, should you use SPICE or IBIS models? We compare these options in this article.
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How I/O Terminations Are Modeled in Integrated Circuits
Packages and buffers on an I/O may include simple terminations that tell you a lot about signal behavior.
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TinyML Will Drive More Advances in Embedded AI
Learn about TinyML and how to implement TinyML-based applications in an embedded system.
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How Chip-on-Board PCBs Are Manufactured
Chip-on-board PCBs are manufactured through a process known as thermocompression bonding. Learn more about this process in this article.
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How Simulation Tools Perform Linear Network Extraction
Learn about linear network extraction from electrical measurements and field solver simulations.
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How is PDN Impedance Measured?
PDN impedance measurements with a vector network analyzer are examined in this article.
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Will Silicon Interconnect Fabric Play a Role in Advanced Packaging?
A new type of interconnect architecture, known as silicon interconnect fabric, may play an interesting role in advanced packaging.
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Frontiers in Transparent Electronics in 2023
We review current trends in transparent electronics materials, applications, and manufacturing.
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What Causes Duty Cycle Distortion?
Duty cycle distortion can be seen in an eye diagram and it results from incorrect timing of signals driven into a high-speed channel.
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How to Read an Eye Diagram
Learn how to read the statistics and mask in an eye diagram for high-speed PCBs.
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