Electronic designs are increasing in capacity, complexity, and performance. This is coupled with increasing pressure to get new products to market as quickly as possible while, at the same time...
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An electrical system consisting of multiple power supply voltages might fail due to PDN noise. It’s critical to maintain the required current and voltage levels with least power fluctuations ...
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Designers tend to place a large number of decoupling capacitors on PDNs to control impedance and EMI. But unplanned numbers and placement might lead to over design and overshoot your budget.
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The double data rate synchronous dynamic random-access memory (DDR SDRAM) has evolved from a data rate of 0.4 Gbps to the next generation, DDR5, scaling to 6.4 Gbps. With DDR5...
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3D-ICs meet the demand for integration of disaggregated system-on-chip (SoC) architecture built from multiple chiplets and heterogeneous architectures such as analog, digital, optoelectronics...
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Signal reflection and impedance mismatch are directly related. Learn more about the causes of and solutions to signal reflection in our brief guide.
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Use impedance matching techniques in antenna feedlines to ensure maximum power transfer into an antenna element.
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Learn about the different types of harmonic distortion that affect signal quality.
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Signal integrity testing involves capturing multiple measurements and comparing data with simulation results. You can take a scientific approach with the right simulation package.
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Boost converter waveforms closely resemble their buck converter cousins in terms of ripple and charging/discharging reactive components.
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Learn about design and fabrication techniques for through-silicon vias in 3D integrated circuits in advanced packaging.
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This white paper highlights the features in Sigrity™ X SI/PI solutions for system-level SI/PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows.
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Electronics technology is proliferating to new, creative applications and appearing in our everyday lives. To compete, system companies are increasingly designing their own semiconductor...
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The switching capacity in electrical circuits defines the current limits required to switch off a system that experiences a ground fault.
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Learn about the advantages of 3D integrated circuits and how heterogeneous integration takes these systems into new areas.
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Switching activity in ICs determines dynamic power consumption. You can use switching activity to measure power consumption of a device with high accuracy.
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Phase noise and jitter in digital electronics define how a signal experiences random variations in edge rates in the time and frequency domains.
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Wondering what the difference between the boundary element method vs. the finite element method is? Numerical modeling using BEM uses boundary discretization whereas FEM uses domain discretization.
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Low power design through voltage scaling is a primary method to reduce total power consumption in VLSI.
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Phase noise in a frequency synthesizer causes deviations in the timing of an analog signal. Learn more about frequency synthesis and phase noise to select the best oscillator.
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