Signal Integrity simulation tools and SI analysis cover high-speed designs, jitter analysis, crosstalk, and more across a range of frequency bands.
Designers tend to place a large number of decoupling capacitors on PDNs to control impedance and EMI. But unplanned numbers and placement might lead to over design and overshoot your budget.
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Learn about the advantages of 3D integrated circuits and how heterogeneous integration takes these systems into new areas.
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This white paper highlights the features in Sigrity™ X SI/PI solutions for system-level SI/PI analysis that enable designers to cut the number of design respins and meet short time-to-market windows.
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More modern electronics systems require an analog interface to accept signals from the external environment. Learn more about analog design in these systems.
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Signal reflection and impedance mismatch are directly related. Learn more about the causes of and solutions to signal reflection in our brief guide.
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3D Packaging vs 3D Integration
Free eBookAn electrical system consisting of multiple power supply voltages might fail due to PDN noise. It’s critical to maintain the required current and voltage levels with least power fluctuations ...
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3D-ICs meet the demand for integration of disaggregated system-on-chip (SoC) architecture built from multiple chiplets and heterogeneous architectures such as analog, digital, optoelectronics...
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Learn about design and fabrication techniques for through-silicon vias in 3D integrated circuits in advanced packaging.
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Signal integrity testing involves capturing multiple measurements and comparing data with simulation results. You can take a scientific approach with the right simulation package.
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Use impedance matching techniques in antenna feedlines to ensure maximum power transfer into an antenna element.
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224G PAM-4 differential pairs must operate in TEM propagation modes to ensure broadband signals can reach a PCB and other components.
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Electronic designs are increasing in capacity, complexity, and performance. This is coupled with increasing pressure to get new products to market as quickly as possible while, at the same time...
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Electrochemical migration
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Boost converter waveforms closely resemble their buck converter cousins in terms of ripple and charging/discharging reactive components.
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The double data rate synchronous dynamic random-access memory (DDR SDRAM) has evolved from a data rate of 0.4 Gbps to the next generation, DDR5, scaling to 6.4 Gbps. With DDR5...
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The switching capacity in electrical circuits defines the current limits required to switch off a system that experiences a ground fault.
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Electronics technology is proliferating to new, creative applications and appearing in our everyday lives. To compete, system companies are increasingly designing their own semiconductor...
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Signal integrity and impedance matching are intimately related. Here’s why you should care about impedance matching to ensure signal integrity.
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Switching activity in ICs determines dynamic power consumption. You can use switching activity to measure power consumption of a device with high accuracy.
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Learn why high-frequency PCB traces are more vulnerable to crosstalk, reflection, noise, and interference.
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