FEA/CFD Analysis for Fluid-Structure Interaction Studies
FEA/CFD analysis is a software-based simulation tool that can be used to enhance the performance, reliability, and safety of engineering designs.
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Thermal Analysis
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The Importance of Matching the CTE of Silicon
Minimize stress and prevent failures in silicon-based devices by matching the CTE of silicon with the CTE of the bonding material.
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Free e-Books from Experts in the Field
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The Effect of the Linear Coefficient of Thermal Expansion of Thermal Barrier Coatings
The four layers in TBCs are different in chemical, mechanical, and thermal properties. Different TBC materials possess different linear coefficients of thermal expansion.
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Advantages of SiC Thermal Shock Resistance
Due to its high thermal shock resistance, low thermal expansion, and high thermal conductivity, SiC is a popular ceramic in the industry.
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Improve Product Design with Accelerated Life Testing Thermal Cycling
Accelerated life testing thermal cycling quantifies the life characteristics, failures, and defects that occur when products are employed in the field.
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Heat Transfer Simulator for Analyzing Thermal Effects
In electronic circuit systems, heat transfer negatively impacts performance. The investigation of heat transfer using simulation is helpful to design effective thermal management.
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Temperature-Dependent Johnson-Nyquist Noise in Electronic Circuits
Johnson-Nyquist noise is the random, temperature-dependent thermal noise generated in electronic circuits.
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What Causes Thermal Hysteresis in a Voltage Reference?
Thermal hysteresis creates permanent changes in the output voltage from a precision reference voltage circuit.
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Prevent the Degradation of Heated Components With Thermal Barrier Coatings
Thermal barrier coatings help minimize the degradation of metallic structures due to heat flux, improving the efficiency and performance of the system.
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The Need for Temperature Compensation in a Strain Gauge
Using active-dummy and self-temperature compensating methods can mitigate the temperature sensitivity of the strain gauge.
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Thermal Management in SoCs with Thermal Voltage Diodes
Thermal voltage diodes are useful for detecting die temperature in SoCs.
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Achieve Excellent Thermal Contact and Heat Transfer Rates with Integrated Circuit Thermal Pads
Thermal management in electronics consists of active heat sinks, passive heat sinks, and TIM. Among the various TIMs, integrated circuit thermal pads are effective at speeding up the cooling of integr
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Sense the System Temperature from the Thermocouple Output Voltage
Temperature sensors based on thermocouples are robust and suitable for a wide range of applications from extremely low to high temperatures.
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Conduct Burn-In Testing in Semiconductor Devices to Ensure Reliability
Semiconductors use burn-in testing to identify potential failures, ensuring the reliability of components.
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Demystifying Maximum Power Output Concepts
The maximum power transfer theorem can explain the relationship between two different—but related—concepts: maximum power output and maximum power efficiency.
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IC Thermal Pad: Best Design and Usage Practices
An IC thermal pad gives you a quick way to move heat away from a high power component and into a heatsink.
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Using an Infrared Phototransistor in Electro-optics
An infrared phototransistor is one option for building detectors for optical systems and electro-optical equipment.
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Sideline the Thermal Challenges of Embedded Systems
A discussion of the thermal challenges of embedded systems and various ways to mitigate these issues through various design and thermal management strategies.
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ESD Diodes as a Countermeasure for Static Electricity Discharge
ESD diodes are an anti-static component to protect ICs and USB lines from ESD.
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Keyless Locks Using VCSEL Sensors
Improve the sensing and communication in signal processing systems using VCSEL sensors.
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