Steady-State vs. Transient Heat Transfers in Electronic Circuit Boards
Wondering what the difference between steady-state vs. transient heat transfer is? Read on to learn more about these two types of heat transfer.
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Thermal Analysis
To learn more about finite element analysis (FEA) heat transfer, using the finite volume method (FVM), or properties like radiation, convection, and cooling of electronics, look into this educational thermal analysis stream.
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Narrow-Band LNA Designs in RF Receiver Front End
LNA is the building block of any communication receiver circuit. Here’s what you need to know about narrow-band LNA designs.
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Free e-Books from Experts in the Field
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The Electrical and Thermal Characteristics Influencing Thermal Interface Material Selection
The thermal conductivity, resistance, and impedance of a material should be considered during the thermal interface material selection process.
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Increase the Thermal Performance of Electronic Components with Heat Sink Optimization
Heat sink optimization is critical to improving electronic cooling. Read on to learn more about heat sinks and how to best optimize their design.
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Using PCB Thermal Simulation in the Pre-Development Design Phase
The impact of heat on PCB performance, reliability, and efficiency is significant, making it necessary to run PCB thermal simulations of design layouts to ensure electronic product designs are optimiz
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Thermal Management and Analysis: Rising to Meet the Thermal Challenge
Thermal management effects on electrical performance have always existed; processor speed limits are set by thermal limits, and power has been a key concern for the mobile and datacenter markets.
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Celsius Thermal Solver Datasheet
A complete electrical-thermal co-simulation technology for IC packages, PCBs, and systems.
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FEA/CFD Analysis for Fluid-Structure Interaction Studies
FEA/CFD analysis is a software-based simulation tool that can be used to enhance the performance, reliability, and safety of engineering designs.
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The Importance of Matching the CTE of Silicon
Minimize stress and prevent failures in silicon-based devices by matching the CTE of silicon with the CTE of the bonding material.
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The Effect of the Linear Coefficient of Thermal Expansion of Thermal Barrier Coatings
The four layers in TBCs are different in chemical, mechanical, and thermal properties. Different TBC materials possess different linear coefficients of thermal expansion.
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Advantages of SiC Thermal Shock Resistance
Due to its high thermal shock resistance, low thermal expansion, and high thermal conductivity, SiC is a popular ceramic in the industry.
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Improve Product Design with Accelerated Life Testing Thermal Cycling
Accelerated life testing thermal cycling quantifies the life characteristics, failures, and defects that occur when products are employed in the field.
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Heat Transfer Simulator for Analyzing Thermal Effects
In electronic circuit systems, heat transfer negatively impacts performance. The investigation of heat transfer using simulation is helpful to design effective thermal management.
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Temperature-Dependent Johnson-Nyquist Noise in Electronic Circuits
Johnson-Nyquist noise is the random, temperature-dependent thermal noise generated in electronic circuits.
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What Causes Thermal Hysteresis in a Voltage Reference?
Thermal hysteresis creates permanent changes in the output voltage from a precision reference voltage circuit.
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Prevent the Degradation of Heated Components With Thermal Barrier Coatings
Thermal barrier coatings help minimize the degradation of metallic structures due to heat flux, improving the efficiency and performance of the system.
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The Need for Temperature Compensation in a Strain Gauge
Using active-dummy and self-temperature compensating methods can mitigate the temperature sensitivity of the strain gauge.
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Thermal Management in SoCs with Thermal Voltage Diodes
Thermal voltage diodes are useful for detecting die temperature in SoCs.
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Achieve Excellent Thermal Contact and Heat Transfer Rates with Integrated Circuit Thermal Pads
Thermal management in electronics consists of active heat sinks, passive heat sinks, and TIM. Among the various TIMs, integrated circuit thermal pads are effective at speeding up the cooling of integr
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Sense the System Temperature from the Thermocouple Output Voltage
Temperature sensors based on thermocouples are robust and suitable for a wide range of applications from extremely low to high temperatures.
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