The integration between Microwave Office® and the Celsius™ Thermal Solver helps save considerable time in analyzing the thermal model and operating temperatures of RF ICs (power amplifiers), MMICs, an
Watch Video
Thermal filler materials are used to lower the thermal resistance of a heat sinking element. Learn more about thermal fillers in this article to see how to take advantage of heat sinking materials
Read Article
Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
Read Article
Learn why battery cooling systems in electric vehicles are so critical in our brief article.
Read Article
Learn about how thermal shock testing and thermal cycling testing differ in this article.
Read Article
Learn more about the types of recombination in semiconductors, including radiative and non-radiative recombination.
Read Article
Learn how to calculate thermal resistance using the basic thermal resistance equation in our brief article.
Read Article
Learn about the thermal resistance of convection as well as the different types of convection in our brief article.
Read Article
Learn about the various electronic cooling methods that can be used to drive heat away from electronics in our brief article.
Read Article
Learn more about the two techniques used for developing heat transfer models of 3D-ICs.
Read Article
In the electronics industry, the application of numerical methods in heat transfer problems helps engineers develop efficient thermal management techniques.
Read Article
Thermal resistance is the measure of the ability of an IC package to transfer heat from the junction to the package and then to the ambient.
Read Article
Learn how to derive the radiation thermal resistance of a heat sink using the electric circuit analogy.
Read Article
In the combined conduction and convection heat transfer process that takes place in heat sinks, convective losses from the fins affect the conduction rate along the fins.
Read Article
Ensure your electronics product design is reliable and efficient by optimizing its thermal management system using CFD thermal analysis.
Read Article
The most important aspect of increasing the heat dissipation in electronic devices is to provide enough surface area for the heat to dissipate from the body to the ambient.
Read Article
Thermal management in electronics utilizes the principles of thermodynamics and heat transfer to control temperature and noise in electronic circuits.
Read Article
In electrical and electronics products, high power density designs are achieved by modifying the configuration and topology of power supplies, power ICs, or power converters.
Read Article
With increased design complexity and miniaturization, it's critical to understand the thermal behavior of the system. Massively parallel architecture of Celsius thermal solver delivers ...
Watch Video
To ensure the thermal stability of your design it’s required to predict all the heat sources earlier in the design cycle. Active components and power sources are the main contributors of heat.
Watch Video
Loading More...
