The integration between Microwave Office® and the Celsius™ Thermal Solver helps save considerable time in analyzing the thermal model and operating temperatures of RF ICs (power amplifiers), MMICs, an
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IPC-2221 and IPC-2152 are two design standards defining practices for thermal reliability.
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Extreme PCB thermal management demands extreme copper. See how heavy copper is taken to the next level with embedded copper structures like copper coins.
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Simulation-driven design offers opportunities to evaluate complex systems before prototyping and production.
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Watch the recording of this CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results...
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Thermal filler materials are used to lower the thermal resistance of a heat sinking element. Learn more about thermal fillers in this article to see how to take advantage of heat sinking materials
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Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
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Learn why battery cooling systems in electric vehicles are so critical in our brief article.
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Learn about how thermal shock testing and thermal cycling testing differ in this article.
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Learn more about the types of recombination in semiconductors, including radiative and non-radiative recombination.
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Learn how to calculate thermal resistance using the basic thermal resistance equation in our brief article.
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Learn about the thermal resistance of convection as well as the different types of convection in our brief article.
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Learn about the various electronic cooling methods that can be used to drive heat away from electronics in our brief article.
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Learn more about the two techniques used for developing heat transfer models of 3D-ICs.
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In the electronics industry, the application of numerical methods in heat transfer problems helps engineers develop efficient thermal management techniques.
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Thermal resistance is the measure of the ability of an IC package to transfer heat from the junction to the package and then to the ambient.
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Learn how to derive the radiation thermal resistance of a heat sink using the electric circuit analogy.
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In the combined conduction and convection heat transfer process that takes place in heat sinks, convective losses from the fins affect the conduction rate along the fins.
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Ensure your electronics product design is reliable and efficient by optimizing its thermal management system using CFD thermal analysis.
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The most important aspect of increasing the heat dissipation in electronic devices is to provide enough surface area for the heat to dissipate from the body to the ambient.
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