The impact of heat on PCB performance, reliability, and efficiency is significant, making it necessary to run PCB thermal simulations of design layouts to ensure electronic product designs are optimiz
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Thermal management effects on electrical performance have always existed; processor speed limits are set by thermal limits, and power has been a key concern for the mobile and datacenter markets.
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FEA/CFD analysis is a software-based simulation tool that can be used to enhance the performance, reliability, and safety of engineering designs.
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Minimize stress and prevent failures in silicon-based devices by matching the CTE of silicon with the CTE of the bonding material.
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The four layers in TBCs are different in chemical, mechanical, and thermal properties. Different TBC materials possess different linear coefficients of thermal expansion.
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Due to its high thermal shock resistance, low thermal expansion, and high thermal conductivity, SiC is a popular ceramic in the industry.
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Accelerated life testing thermal cycling quantifies the life characteristics, failures, and defects that occur when products are employed in the field.
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In electronic circuit systems, heat transfer negatively impacts performance. The investigation of heat transfer using simulation is helpful to design effective thermal management.
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Johnson-Nyquist noise is the random, temperature-dependent thermal noise generated in electronic circuits.
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Thermal hysteresis creates permanent changes in the output voltage from a precision reference voltage circuit.
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Thermal barrier coatings help minimize the degradation of metallic structures due to heat flux, improving the efficiency and performance of the system.
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Using active-dummy and self-temperature compensating methods can mitigate the temperature sensitivity of the strain gauge.
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Thermal voltage diodes are useful for detecting die temperature in SoCs.
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Thermal management in electronics consists of active heat sinks, passive heat sinks, and TIM. Among the various TIMs, integrated circuit thermal pads are effective at speeding up the cooling of integr
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Temperature sensors based on thermocouples are robust and suitable for a wide range of applications from extremely low to high temperatures.
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Semiconductors use burn-in testing to identify potential failures, ensuring the reliability of components.
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The maximum power transfer theorem can explain the relationship between two different—but related—concepts: maximum power output and maximum power efficiency.
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An IC thermal pad gives you a quick way to move heat away from a high power component and into a heatsink.
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An infrared phototransistor is one option for building detectors for optical systems and electro-optical equipment.
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