To learn more about finite element analysis (FEA) heat transfer, using the finite volume method (FVM), or properties like radiation, convection, and cooling of electronics, look into this educational thermal analysis stream.
The integration between Microwave Office® and the Celsius™ Thermal Solver helps save considerable time in analyzing the thermal model and operating temperatures of RF ICs (power amplifiers), MMICs, an
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Thermal simulations for electronics in an enclosure need boundary conditions and source definitions based on temperature measurements.
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Chip packaging evaluation can involve complex multiphysics simulations. Here are some of the main simulations needed in these systems.
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3D Packaging vs 3D Integration
Free eBookIPC-2221 and IPC-2152 are two design standards defining practices for thermal reliability.
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Extreme PCB thermal management demands extreme copper. See how heavy copper is taken to the next level with embedded copper structures like copper coins.
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Simulation-driven design offers opportunities to evaluate complex systems before prototyping and production.
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Watch the recording of this CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results...
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Thermal filler materials are used to lower the thermal resistance of a heat sinking element. Learn more about thermal fillers in this article to see how to take advantage of heat sinking materials
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Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
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Learn why battery cooling systems in electric vehicles are so critical in our brief article.
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Learn more about the types of recombination in semiconductors, including radiative and non-radiative recombination.
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Learn how to calculate thermal resistance using the basic thermal resistance equation in our brief article.
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Learn about the thermal resistance of convection as well as the different types of convection in our brief article.
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Learn about the various electronic cooling methods that can be used to drive heat away from electronics in our brief article.
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Learn more about the two techniques used for developing heat transfer models of 3D-ICs.
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In the electronics industry, the application of numerical methods in heat transfer problems helps engineers develop efficient thermal management techniques.
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Learn how to derive the radiation thermal resistance of a heat sink using the electric circuit analogy.
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In the combined conduction and convection heat transfer process that takes place in heat sinks, convective losses from the fins affect the conduction rate along the fins.
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Ensure your electronics product design is reliable and efficient by optimizing its thermal management system using CFD thermal analysis.
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The most important aspect of increasing the heat dissipation in electronic devices is to provide enough surface area for the heat to dissipate from the body to the ambient.
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