How to Use a Guard Ring in a PCB
Guard rings in a PCB are used to assist in EMI reduction, and they can be easily drawn into a PCB layout with copper pour and vias.
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Detailing power integrity, signal integrity, thermal analysis, and electromagnetic simulation industry trends, knowledge, technology, and applications.
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CMOS Noise Margin Values
Power integrity and signal integrity design choices only work if they keep noise within the CMOS noise margin.
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Matching Thermal Measurements to Simulations
Thermal simulations for electronics in an enclosure need boundary conditions and source definitions based on temperature measurements.
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Power Supply Control Loop Transfer Function Construction
Power supply control loop transfer function can be determined from the output impedance of the power supply
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How Selective Harmonic Elimination is Used in Circuits
Circuits with THD from fast switching pulses can restore signal quality with selective harmonic elimination.
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Embedded Systems With Generative AI Will Soon Be Real
Embedded systems can leverage generative AI capabilities as long as a dataset is available and processors can support.
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When to Use a Lookup Table in a Microcontroller
Micontrollers can store important data in a lookup table and use these for logical comparisons.
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3D Packaging vs 3D Integration
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The Concept of Portability in AI Apps and Hardware
AI has a portability problem, and that problem only gets bigger when you add custom hardware into the mix. Here’s how a modular hardware approach helps solve the problem.
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Group Delay Engineering in RF Filters
Signals that propagate through filters can experience varying group delay dispersion. Here's how it's engineered.
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Phase Delay vs. Group Delay: What's the Difference?
Phase delay and group delay are two related concepts that arise in high-speed PCBs and RF systems.
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What Simulations Are Needed for Chip Packaging?
Chip packaging evaluation can involve complex multiphysics simulations. Here are some of the main simulations needed in these systems.
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How Long Does a Trace Taper or Teardrop Need to Be?
Two types of routing connections to pads and vias are teardrops and tapers. Here’s how long these need to be to work properly.
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Fundamental RF/Microwave Principles for Your Next School Project
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3 Ways to Extract DUT S-Parameters
S-parameters for a DUT can be isolated with de-embedding, electrical delay, or port extension using your VNA.
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What Could Cause a Solder Joint to Crack?
Solder joint cracking results from several possible causes, ranging from excess vibration to incorrect soldering of through-holes.
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What ASIC Package Size is Needed to Get Past 224G?
224G PAM-4 differential pairs must operate in TEM propagation modes to ensure broadband signals can reach a PCB and other components.
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Will Skip-Layer Routing Work Past 56 GHz?
224G PAM-4 systems use data rates that require 56 GHz Nyquist frequencies. Can skip-layer routing work in these component packages?
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Three Electronics Cooling Options in Your Enclosure
Enclosures for a PCB assembly can help with thermal management by providing directed airflow and functioning as a large heat sink.
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Configuration Signal Edge Rate and Filtering
Configuration signals in an embedded system can connect to many different components. How fast do these signals need to be, and can you slow these down?
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How Electronic DC Loads Work
An electronic DC load is an essential piece of equipment for any lab. Learn about the operation of these units for power supply testing.
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Working Fluids In Heat Pipes
All heat pipes include a working fluid that is responsible for heat transfer away from a hot component.
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