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PIC vs. EIC

Key Takeaways

  • The EIC is a chip that makes use of all electronic devices, whereas PIC consists of photonic components.

  •  Either visible light or near-infrared light is utilized for PIC operation.

  • PIC and EIC can be distinguished based on the raw material used for fabrication. 

PIC vs. EIC

The demand for PICs has increased over the years due to their advantageous characteristics    

We often use electronic integrated circuits (EIC) and photonic integrated circuits (PIC) in electronic gadgets and systems. EICs are chips that make use of all electronic devices, whereas PICs consist of photonic components. When comparing PIC vs. EIC, we can bring up the component equivalence comparison such as waveguides vs. electronic wires, lasers vs. transistors, etc. Let’s learn more about PIC and EIC in this article. 

EIC and PIC

Venn Diagram of Electronic integrated circuits

Integrated circuits (IC) are the cornerstone of modern-day electronics. Most systems that we work on use IC technology in the form of components such as logic gates, timers, registers, microprocessors, microcontrollers, FPGAs, sensors, etc. Nowadays, it is hard to build hardware without using at least one IC.

The little chips that we commonly see in electronic boards can be EIC or PIC. When optical communication systems were developed for long-distance communication, a lot of optical devices such as photodetectors, waveguides, lasers, optical amplifiers, etc. were extensively included in electronic systems. The traditional designs of discrete optical components posed serious challenges questioning the reliability of the system.

In the early 2000s, PICs were introduced onto the market to improve the reliability, functionality, and scalability of optical components. They were made of hundreds of optical components that offered significantly better output than discrete optical systems.

Photonic Integrated Circuits (PIC)

PIC Operation

Instead of electrons, PICs use components that work on light energy or photons. Usually, there is a laser source present in PICs to drive the components by injecting light. Jumping to light from electrons improves the integration, miniaturization, and speed, and reduces the heat generation and cost of the integrated circuit technology.

PIC Integration Process

The two types of integration processes involved in PIC fabrication are monolithic photonic integration and hybrid photonic integration.

PIC integration processes

Quick Facts About PIC

Applications of PIC

  • Automotive sensors
  • Advanced driver assistance system
  • Autonomous driving
  • Electric/hybrid drive trains
  • LIDAR
  • Healthcare system
  • Biosensors
  • Data and telecommunication system

Advantages

  • Less energy consumption
  • Low thermal loss
  • Reduction in cooling or shielding
  • High speed
  • Integration with EIC is possible

Integration Processes

  • Monolithic process
  • Hybrid process

PIC Raw Materials

  • Silica-on-silicon
  • lll-V materials
  • Lithium Niobate
  • Polymer 
  • Silicon

Components of PIC

  • Optical amplifiers
  • Lasers
  • Attenuators
  • Photodetectors 
  • Multiplexers
  • Demultiplexers

PIC vs. EIC

PIC and EIC can be distinguished based on the raw material used for chip fabrication. The selection of material for PIC fabrication depends on the purpose of the chips. EIC of any functionality can be fabricated on silicon. The table below summarizes some of the raw materials used for PIC fabrication and their associated characteristics.

Characteristics

Ⅲ-V Material

Silica on Silicon

Silicon

Optical devices

Optical amplifiers, lasers, detectors, modulators

Filters, switches, splitters, modulators

Filters, switches, modulators

Propagation loss

Comparatively high

Low

Comparatively high

Refractive Index Contrast

Low

Low

High

Capability with CMOS EIC

Incompatible

Compatible

Compatible

Themes-optic coefficient

High

Low

-

Reliability

High

High

High

More differences between PICs and EICs are below. 

Parameter

PIC

EIC

Availability

Low

High

Size

Large

Small

Speed

High

Low

Power efficiency

High

Low

Bandwidth

High

Low

Primary device

Transistor

No particular
device

Why Use PIC Over EIC?

EIC are reaching their maximum capacity of integration and there is limited room for further developments or improvements fabrication-wise. The potential of PIC technology is being explored in fields such as data communication, autonomous vehicles, aerospace, aeronautical systems, etc.

PIC technology is evolving and cutting-edge research has been going on to achieve even more efficient and low-cost PIC. To adapt to the future of electronics, Cadence offers an integrated electronic/photonic design automation (EPDA) environment that can help you design PIC-related technology.

Leading electronics providers rely on Cadence products to optimize power, space, and energy needs for a wide variety of market applications. If you’re looking to learn more about our innovative solutions, talk to our team of experts or subscribe to our YouTube channel.

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