Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an integrated design flow within the Cadence® AWR Design Environment® platform circuit design software for an MCM monolithic microwave integrated circuit (MMIC) design using a 2.5GHz gallium arsenide (GaAs) power amplifier (PA) along with a microwave laminate module to form the output match. This paper follows the “RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design” white paper, which examines GaAs pHEMT PA design approach from a systems perspective.