About Cookies On This Site

This website uses essential cookies that are necessary for the operation of this website and that are always set.

With your consent and by selecting "Accept All Cookies," we may also enable non-essential cookies (such as analytics and behavioral cookies) in order to personalize and enhance your experience on our website. You can modify or further customize your selections at any time.

We also share your personal data with our trusted third-party providers to achieve the purposes described above. For a list of our third-party providers and for more information about our cookies and how we use them, please see our Cookie Policy and Privacy Policy.

Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages

October 19, 2018

Cadence PCB Solutions

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages.

Download PDF

This paper presents full-wave electromagnetic field simulations on the effects of shorting via arrays for the reduction of power and ground noise in IC packages. Properties of internal resonance in multi-layered packages are studied. Effects of area-array power and ground vias of different densities are evaluated by examining the input impedances of the package power supply. It is shown that, by properly selecting the density of shorting via arrays, package resonance can be removed from DC to multi-gigahertz frequency range.