Multi-Chip Module Design, Verification, and Yield Optimization

This application note presents a unified design flow, inclusive of all process technologies, enabling designers of wireless communications systems that incorporate multi-technology-based modules to leverage the strengths of specialized EM modeling and circuit analysis tools to address various functional block technologies, maintaining all through a single user-interface environment. The application is a dual band, 1.9GHz (cellular) 2.5GHz WLAN front-end module that includes two power amplifiers (GaAs and SiGe), surface-mount BAW filters, and a laminate substrate.