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How To Join Blocks In Pointwise

How To Join Blocks In Pointwise

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TE Modes in Rectangular and Circular Waveguides

Learn more about how the transverse electric mode (TE mode) of wave propagation works in rectangular and circular waveguides.
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Methods for Grid Generation in CFD Simulations

Grid generation in CFD involves the subdivision of a spatial region into a collection of discrete geometric cells. Learn some of the important mesh generation techniques used for CFD in this article.

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about 2 months ago
How to Use a Guard Ring in a PCB

Guard rings in a PCB are used to assist in EMI reduction, and they can be easily drawn into a PCB layout with copper pour and vias.

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about 2 months ago
CMOS Noise Margin Values

Power integrity and signal integrity design choices only work if they keep noise within the CMOS noise margin.

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2 months ago
Matching Thermal Measurements to Simulations

Thermal simulations for electronics in an enclosure need boundary conditions and source definitions based on temperature measurements.

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3 months ago
Power Supply Control Loop Transfer Function Construction

Power supply control loop transfer function can be determined from the output impedance of the power supply

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3 months ago
How Selective Harmonic Elimination is Used in Circuits

Circuits with THD from fast switching pulses can restore signal quality with selective harmonic elimination.

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3 months ago
Embedded Systems With Generative AI Will Soon Be Real

Embedded systems can leverage generative AI capabilities as long as a dataset is available and processors can support.

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4 months ago
When to Use a Lookup Table in a Microcontroller

Micontrollers can store important data in a lookup table and use these for logical comparisons.

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4 months ago
The Concept of Portability in AI Apps and Hardware

AI has a portability problem, and that problem only gets bigger when you add custom hardware into the mix. Here’s how a modular hardware approach helps solve the problem.

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4 months ago
Group Delay Engineering in RF Filters

Signals that propagate through filters can experience varying group delay dispersion. Here's how it's engineered.

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4 months ago
Phase Delay vs. Group Delay: What's the Difference?

Phase delay and group delay are two related concepts that arise in high-speed PCBs and RF systems.

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4 months ago
What Simulations Are Needed for Chip Packaging?

Chip packaging evaluation can involve complex multiphysics simulations. Here are some of the main simulations needed in these systems.

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5 months ago
How Long Does a Trace Taper or Teardrop Need to Be?

Two types of routing connections to pads and vias are teardrops and tapers. Here’s how long these need to be to work properly.

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5 months ago
3 Ways to Extract DUT S-Parameters

S-parameters for a DUT can be isolated with de-embedding, electrical delay, or port extension using your VNA.

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5 months ago
What Could Cause a Solder Joint to Crack?

Solder joint cracking results from several possible causes, ranging from excess vibration to incorrect soldering of through-holes.

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4 days ago
What ASIC Package Size is Needed to Get Past 224G?

224G PAM-4 differential pairs must operate in TEM propagation modes to ensure broadband signals can reach a PCB and other components.

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5 months ago
Will Skip-Layer Routing Work Past 56 GHz?

224G PAM-4 systems use data rates that require 56 GHz Nyquist frequencies. Can skip-layer routing work in these component packages?

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6 months ago
Three Electronics Cooling Options in Your Enclosure

Enclosures for a PCB assembly can help with thermal management by providing directed airflow and functioning as a large heat sink.

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6 months ago
Configuration Signal Edge Rate and Filtering

Configuration signals in an embedded system can connect to many different components. How fast do these signals need to be, and can you slow these down?

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6 months ago
How Electronic DC Loads Work

An electronic DC load is an essential piece of equipment for any lab. Learn about the operation of these units for power supply testing.

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6 months ago
Working Fluids In Heat Pipes

All heat pipes include a working fluid that is responsible for heat transfer away from a hot component.

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