AWR Microwave Office Thermal Integration Demonstration
Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
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Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
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The textbook covers microwave components, as well as how they fit into modern radio, radar, and sensor systems.
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Electronic designs are increasing in capacity, complexity, and performance. This is coupled with increasing pressure to get new products to market as quickly as possible while, at the same time...
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Seagate and IDC collaborated on some research and are forecasting that the world’s total stored data will reach 175 zettabytes (ZB) in 2025.
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The double data rate synchronous dynamic random-access memory (DDR SDRAM) has evolved from a data rate of 0.4 Gbps to the next generation, DDR5, scaling to 6.4 Gbps. With DDR5...
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The modern world of advanced multi-chip packaging has evolved over the years in a very subtle way. Today's advanced IC packaging is about adding value to end products. Electronic product design...
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Today’s data-thirsty world is looking forward to the next-generation communication systems beyond 5G, the promise of massive connectivity to the internet with extreme capacity, coverage...
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In recent years, driven by the demand for smarter electronics, device designers have witnessed enormous scaling of large and hyperscale integrated circuits (ICs) and embraced development...
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3D-ICs meet the demand for integration of disaggregated system-on-chip (SoC) architecture built from multiple chiplets and heterogeneous architectures such as analog, digital, optoelectronics...
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