Module Design with AWR Software
The AWR Design Environment supports modeling and simulation co-design of MMIC/RFIC die integrated into complex packaging technologies used in today's RF modules.
The AWR Design Environment supports modeling and simulation co-design of MMIC/RFIC die integrated into complex packaging technologies used in today's RF modules. Microwave Office for module design helps engineers to solve today’s tough design challenges and maintain a competitive advantage with high-performance products delivered to market faster.