DATASHEET
Module Design with AWR Software
Simulation and design flow technologies that support module product development
RF modules combine multiple integrated circuits (ICs) into a single package, offering a large
amount of functionality in a small space. This level of device integration can be an engineering
challenge, requiring design teams to model the electrical behavior of different monolithic
microwave ICs (MMICs), RFICs, and laminate technologies, including interconnects
(transmission lines) and embedded distributed components, as well as RF, analog, and digital
components. Electronic design automation (EDA) software is critical for achieving simulation
results that are closely matched to the final results.
Module Design Advantage
Module designers use multiple technologies, including III-V
semiconductor MMICs, silicon-based RFICs, and multi-
ple-layer laminates, to achieve optimal performance in the
smallest footprint. Each technology is encapsulated in a
specific process design kit (PDK) that details the electrical
and physical attributes of the manufacturing process.
The Cadence
®
AWR Design Environment
®
platform offers a
multi-technology design flow supporting hierarchical
projects composed of diverse process-defined subcircuits,
as well as circuit/EM co-simulation to model on-chip
passives, transmission lines, interconnects, and multi-
layer laminate packaging.