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Module Design with AWR Software

The AWR Design Environment supports modeling and simulation co-design of MMIC/RFIC die integrated into complex packaging technologies used in today's RF modules.

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The AWR Design Environment supports modeling and simulation co-design of MMIC/RFIC die integrated into complex packaging technologies used in today's RF modules. Microwave Office for module design helps engineers to solve today’s tough design challenges and maintain a competitive advantage with high-performance products delivered to market faster.