IQM Uses AWR to Make RF/Microwave Chips for Quantum Computers
Learn how IQM builds quantum computers and uses Cadence AWR software in the circuit and system design of RF/microwave chips to reduce risk in the early stages of prototyping.
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A comprehensive EDA platform for developing RF/microwave products
Learn how IQM builds quantum computers and uses Cadence AWR software in the circuit and system design of RF/microwave chips to reduce risk in the early stages of prototyping.
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This webinar demonstrates how the Cadence AWR Design Environment V16 platform supports an RF-to-PCB workflow
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Cadence Design Systems discusses additions to it AWR Microwave Office such as thermal simulation capabilities as demonstrated on a power amplifier design at EuMW 2021 in London.
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AWR has a variety of easy-to-setup stability analysis techniques available to the designer for use both in design and electrical verification to prevent blown tape-outs caused by instabilities.
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Utilize the pre-configured 5G NR test benches in VSS to measure and display functional specifications.
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Success Stories, White Papers, Datasheets, and More
READ NOWIn this video David Vye talks with Thomas Young of Arralis about the K-band satcom GaN HPA design using AWR software. https://www.arralis.com/
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Reduce the time spent simulating test benches required to do a proper design exploration with sweeping or optimization, or when performing electrical verification with APLAC Turbo.
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Use AWR’s dynamic measurement and source controls to create centrally managed design-review-ready data displays quickly. 
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Ensure that the RF section of your PCB is performing as expected by utilizing the PCB Import and EM verification flow.
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Use measured, or simulated load/source pull and load-pull visualization capabilities of AWR to quickly choose the optimum load/source impedances. 
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This video presentation demonstrates how to use the RF modeling capabilities in Visual System Simulator software for RF link budget design and analysis.
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This webinar will showcase Cadence RF solutions support for design, analysis, and integration of antennas within manufacturing layout flows for PCB, module, and RFIC technologies.
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This presentation introduces capabilities that guide engineers through the design, analysis, and physical realization of new arrays, incorporating real-world radiation patterns, RF links, etc.
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This presentation explains how to use the Visual System Simulation time-domain engine to measure phase noise.
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This talk introduces the United Monolithic Semiconductors foundry and its processes, followed by highlights of techniques supporting device modeling of III-V wide bandgap semiconductor technology.
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This talk presents best practices that can help designers achieve accurate simulation results in a short timeframe.
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The best practices address four main design areas: ports, EM environment, meshing, and simulation.
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This presentation discusses the design of efficiency-enhanced PAs by concurrently controlling input and output harmonics.
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This talk will present examples using the Cadence EM simulators, AXIEM 3D planar method-of-moments (MoM) and Analystâ„¢ 3D finite-element method (FEM), to address EM simulation issues for silicon.
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This talk presents basic Doherty PA theory and design methodology featuring specific simulation and design automation capabilities within Microwave Office circuit design software.
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