AWR Datasheets

RF to mmWave Design for Systems 3 www.cadence.com The Spectre Simulation Platform can simulate RF IP based on Microwave Office software linear models, enabling co-design of RFICs, packages, and modules, inclusive of RF content such as off-chip matching and resonators. For example, Microwave Office software users can design passive off-chip components through circuit design, optimization, and EM verification, and then decide the best implementation technology. In some cases, a network of passive components may be more optimally implemented across the IC package boundary. This is often true for RF modules, where the ideal filter design, matching networks, and power amplifier (PA) output stage load termination often leverage components on both the die and in the package substrate. Microwave Office/Allegro Workflow RF/microwave IP created and analyzed in Microwave Office software can be developed using Allegro libraries and technologies, ensuring compatibility with the Allegro PCB Designer schematic and layout editors, as well as the targeted manufacturing technologies using corporate-ap- proved components. Using an organization's approved bill of materials (BOM) eliminates the need to replace compo- nents in the RF design when edited inside the manufac- turing framework. In addition, physical design constraints set in the Allegro platform are available within Microwave Office software for dynamic voiding of ground/power planes. The Microwave Office to Allegro PCB workflow (Figure 4) provides a seamless schematic and layout data transfer from Microwave Office software to Allegro PCB Design platform, eliminating time-consuming and error-prone manual re-entry. By using parts with identical symbols, footprints, and properties between Allegro and Microwave Office software, RF designs are instantly recognizable to the layout engineer, allowing RF and layout design teams to work collaboratively, yet independently. The Allegro design can be imported back into the AWR Design Environment platform for high-performance, multiphysics analysis and design verification of the entire system after the RF IP has been incorporated with the rest of the PCB. Microwave Office Multiphysics Workflow Clarity 3D Solver Integration Large RF structures such as phased array feed networks are often manually sectioned into smaller structures for analysis using the largest and most powerful computing resources. The Clarity 3D Solver 3D EM simulator, used for designing critical interconnect, RFIC/MMIC, module, PCB, and SoIC designs, overcomes the limitations of legacy EM analysis software by leveraging Cadence's distributed multiprocessing technology to deliver virtually unlimited capacity and 10X speed. Microwave Office AXIEM, Analyst, Clarity, and Celsius Allegro RF IP Layout Technology File Unified Libraries Figure 4. Design and manufacturing work flows for Microwave Office/Allegro PCB support RF IP integration and design verification Figure 5. Clarity 3D Solver integration within the Microwave Office software expands the available EM simulators to cover large, complex 3D structures

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