AWR Datasheets

RF to mmWave Design for Systems 4 www.cadence.com Now integrated within AWR software, the Clarity 3D Solver provides RF designers with ready access to high-capacity EM analysis for design verification and signoff of large, complex RF/ mixed-signal systems beyond the capabilities offered by the AXIEM 3D planar and Analyst 3D finite element method (FEM) solvers. The Clarity 3D Solver integration with the Microwave Office software (Figure 5) is an automated process in which the entire analysis experience is fully within the AWR environment. Once the simulation is complete, a dataset with input geometry, simulation setup, and S-parameter results is automatically assembled and associated with the given EM document for plot/measurement and subsequent extraction, circuit simulation, tuning, and optimization. The link also supports mesh, current, and field visualization data in addition to S-parameters, enabling designers to take full advantage of the rich set of EM 3D annotations that already exist in the Microwave Office software. Celsius Thermal Solver Integration IC and electronic system companies, particularly those incorporating IC packaging and/or multi-technology modules, face tremendous thermal challenges that can cause late-stage design modifications and derail project schedules. The Celsius Thermal Solver embedded within the Microwave Office software offers a solution (Figure 6) for RF PA and MMIC designs, RF PCBs, and modules, supporting electro- thermal analysis through model information sourced from Microwave Office sofware's project information, including existing MMIC (die or packaged device) design data and geometries such as layout, material properties, and power- source values from RF simulation. Celsius Thermal Solver structures can be created either by drawing/importing the geometry in the EM editor, or using EM extraction with simulated temperature results automatically returned into Microwave Office software. 3D plots of the thermal temperature distribution can be viewed in the Celsius Thermal Solver native editor. For MMIC structures, the solver also provides a full-chip temperature profile at the relevant resolution of the IC layout, available as a graphically viewable 3D structure temperature overlay in the Celsius Thermal Solver's native editor as well as a temperature-annotated netlist for circuit simulation. Figure 6. The Celsius Thermal Solver's analysis provides color-coded temperature overlay on multi-cell GaN power FET showing heat distribution across device

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