Issue link: https://resources.system-analysis.cadence.com/i/1390145
TECHNICAL BRIEF RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today's electronic systems often integrate heterogeneous technologies (Figure 1) to mitigate the high cost of homogeneous system-on-chip (SoC) solutions by enabling designers to combine proven RFIC and monolithic microwave IC (MMIC) designs on substrates using newer packaging and integration technologies. RF to mmWave Design for Systems Empowered by AWR Design Environment V16 Figure 1. RF-enabled heterogeneous technologies integrated across IC, package, and PCB Engineers trying to bring these products to market need best-in-class simulation technology and design automation to accurately predict the performance of larger, densely integrated circuits and subsystems designed for broadband and millimeter-wave (mmWave) spectrum. In addition, since these products are developed by diverse engineering teams across multiple design tools, RF design software must provide interoperability with the broader class of EDA tools used in the development of mixed-signal electronic systems. The latest release, version 16 (V16), of the Cadence ® AWR Design Environment ® platform, including Microwave Office ® software. Visual System Simulator™ (VSS) commu- nications and radar systems design software, and AXIEM ® 3D planar electromagnetic (EM) and Analyst™ 3D FEM simulators, introduces groundbreaking cross-platform interoperability to support RF IP integration for heteroge- neous technology development across Cadence Virtuoso ® , Allegro ® PCB, Spectre ® simulation, and IC package design platforms, delivering up to a 50% reduction in turnaround time compared to competing workflows. The V16 release further introduces seamless integration with Clarity™ 3D Solver and Celsius ® Thermal Solver, delivering uncon- strained capacity for electrothermal performance analysis of large-scale and complex RF systems. With AWR Design Environment V16, Cadence addresses RF/ microwave design and integration through the company's Intelligent System Design™ strategy, which delivers computational software capabilities across all