Issue link: https://resources.system-analysis.cadence.com/i/1355143
Arralis and Cadence 2 www.cadence.com/go/awr Figure 1 illustrates the low-band transmitter architecture and performance with the integrated HPA. Figure 1: Chipset architecture for K/Ka-band satcom applications Solution During the design phase, extensive circuit design and simulation was performed using the AWR Design Environment platform, specifically AWR Microwave Office software, the AWR AXIEM EM simulator for 3D planar struc- tures (MMIC manifold feed network, on-chip passives, and evaluation board), and the AWR Analyst EM simulator for 3D EM analysis of the package. Arralis designers used the simulation software to work with the active and passive MMIC component models developed by the foundry and organized into process design kits (PDKs) developed through collaboration between the AWR and UMS modeling teams. The MMIC die was represented in simulation using foundry-verified, schematic-based models and EM analysis, allowing the designers to reliably predict and optimize key performance metrics. Figure 2 shows the correlation between measured and modeled S-parameters. The graph also shows the simulated gain variation due to process tolerances. Measured gain performance falls on the high side of the variation; however, it is within the predicted limits of the simulation. Figure 2: Simulated data including yield analysis vs. modeled small- signal frequency response for the LE-Ka1330308 reference board Significant EM analysis and design optimization was carried out at the component and subcircuit level to ensure that parasitics and inadvertent EM coupling between structures was incorporated into the simulation. Towards the end of the design phase, the AWR AXIEM simulator was used for larger and more integrated EM analysis for final verification and to ensure that all interactions were captured in simulation. Cadence's AWR Microwave Office circuit design software combined with the powerful AWR AXIEM and Analyst EM simulators enabled us to work with the active and passive MMIC component models developed by the foundry to design and optimize the Arralis HPA. Thomas Young, Arralis Ltd.