WHITE PAPER
AiP/AiM Design for mmWave Applications -
Advanced RF Front-End Design Flows from
Concept to Signoff
By David Vye, Cadence
System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased
arrays, and integrated antennas and front-ends are evolving. The challenge for
engineers will be achieving the cost, size, and performance requirements that will make
these products commercially viable. All these factors align to drive next-generation
component integration, which includes embedding the antenna within the RF front-end
package or module.
The focus of this white paper is on the general challenge of antenna design and
simulation as implemented with antenna-in-package (AiP) and antenna-in-module (AiM)
advanced packaging technology as well as the software tools necessary for antenna,
antenna array and feed structure, and front-end simulations. Two different aspects will
be addressed: mmWave antenna module packaging and integration for base station and
user equipment applications.
Contents
Background – Applications and Technologies ..2
Design, Analysis, and Manufacturing Layout
Tools ..............................................................................5
PCB Example – Antenna Technologies and
Design ..........................................................................6
AiP Example: 28GHz Handset ................................9
AiM Example: 4x1 Dual-Polarized Antenna ...... 12
Conclusion .................................................................15
