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EDA Software Design Flow Considerations for the RF/Microwave Module Designer

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EDA Software Design Flow Considerations for the RF/Microwave Module Designer Featuring Cadence AWR Software Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an integrated design flow within the Cadence ® AWR Design Environment ® platform circuit design software for an MCM monolithic microwave integrated circuit (MMIC) design using a 2.5GHz gallium arsenide (GaAs) power amplifier (PA) along with a microwave laminate module to form the output match. This paper follows the "RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design" white paper, which examines GaAs pHEMT PA design approach from a systems perspective. WHITE PAPER Contents Overview ......................................................................2 A Module Design Flow ..............................................2 Points of Integration as Elements of Risk ..........2 A Common/Unified Database ................................3 Multiple Technologies ...............................................4 An Integrated Module Design Flow Example ....4 Conclusion .................................................................. 8

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