EDA Software Design Flow Considerations for
the RF/Microwave Module Designer
Featuring Cadence AWR Software
Miniaturization of consumer products, aerospace and defense systems, medical devices, and
LED arrays has spawned the development of a technology known as the multi-chip module
(MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other
discrete components within a unifying substrate for use as a single component. This white
paper outlines the steps for implementing an integrated design flow within the Cadence
®
AWR
Design Environment
®
platform circuit design software for an MCM monolithic microwave
integrated circuit (MMIC) design using a 2.5GHz gallium arsenide (GaAs) power amplifier (PA)
along with a microwave laminate module to form the output match. This paper follows the
"RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design" white paper,
which examines GaAs pHEMT PA design approach from a systems perspective.
WHITE PAPER
Contents
Overview ......................................................................2
A Module Design Flow ..............................................2
Points of Integration as Elements of Risk ..........2
A Common/Unified Database ................................3
Multiple Technologies ...............................................4
An Integrated Module Design Flow Example ....4
Conclusion .................................................................. 8
