Issue link: https://resources.system-analysis.cadence.com/i/1350073
AWR Software 10 www.cadence.com/go/awr Applications and Technologies On-Chip AWR AXIEM software readily analyzes on-chip passive structures, transmission lines, interconnects, vias, and MMIC packaging. Thick metal is supported by creating 3D meshes of extruded planar geometries, accurately accounting for all x, y, and z directed currents on all surfaces—a prerequisite for III-V and silicon MMIC/RFIC designs, which rely on circuit/EM co-simulation to provide embedded parasitic extraction and design verification. With hierarchical EM/circuit co-simulation, designers can perform in-situ EM analysis to capture and correct harmful parasitic couplings and resonances before tapeout. Package and Board The layout-driven PCB design flow in AWR AXIEM software supports accurate simulation of the entire RF signal path. Circuit/system and EM co-simulation provide first-pass design success with complete PCB analysis of surface- mount components, interconnecting transmission lines, and embedded and distributed passive elements, as well as EM verification. EM verification is enabled by importing an IPC-2581 (Gerber or ODB++) file from PCB layout tools such as Cadence Allegro ® technology into AWR software through the PCB import wizard. Powerful editing features prepare the structure for fast, accurate, and efficient EM analysis. Antennas RF designers of today's 5G and IoT smart devices need specialized simulation and optimization technology to develop small-size, embedded antennas with high gain and single- or multi-band, as well as wideband, frequency range. AWR AXIEM software helps engineers design, optimize, and integrate antennas/arrays, providing powerful EM technol- ogies to simulate antenna metrics such as gain, return loss, radiation efficiency, and currents, and to visualize 2D/3D far-field antenna patterns. AWR Microwave Office, AXIEM, and Analyst were pivotal in the analysis of circuit parasitics, tuning towards optimization, and analysis of the effects of environmental disturbance, enabling us to produce an overall more robust product. Nicolas Henriet, Sensata Technologies