AWR Datasheets

Resource Library The resource library on awr.com is a dedicated and searchable landing page for technical content on AWR software products, and solutions. Recent additions to the resource library include: White Paper f Design of a Complete RF Downconverter Module for Test Equipment Application Note f Design and Implementation of a Miniature X-Band Edge-Coupled Microstrip Bandpass Filter Collateral f PCB Design Leveraging RF/Microwave Expertise in Cadence AWR Software Articles f LNA Receiver Design for Integrated Automotive Wireless Systems - High Frequency Electronics f Together We Can Grow WIM: Show Up, Speak Up, Step Up - IEEE Microwave Magazine WHITE PAPER Design of a Complete RF Downconverter Module for Test Equipment With AWR Software By David Vye, Malcolm Edwards, and Andy Wallace, Cadence RF/microwave modules, often referred to as "hybrids," integrate functional blocks used to transmit and/or receive radio signals. These hybrid circuits combine different technologies, including monolithic microwave integrated circuits (MMICs)/RFICs, discrete field-effect transistors (FETs), and passive devices attached to substrates such as alumina or FR4, which contain circuit traces and distributed components, all within a single housing or enclosure. By integrating diverse technologies, RF modules address the challenge of developing cost- effective radio circuitry for low- to medium-volume production, commonly used in test and measurement equipment and aerospace/defense applications. Contents Introduction ................................................................. 1 Module Design ............................................................2 Module Specification ................................................2 Circuit-Level Design and Analysis ........................3 Downconverter Module Design .............................9 Conclusion ..................................................................11 References .................................................................11 APPLICATION NOTE Design and Implementation of a Miniature X-Band Edge-Coupled Microstrip Bandpass Filter Microwave bandpass filters (BPFs) are the fundamental component used in many RF/microwave applications to eliminate interference from signals operating at nearby frequencies. This application note presents a straightforward and largely nonmathematical method for designing an edge-coupled, bandpass filter for X-band operations (8.4- 9.3 GHz) with a combination of filter synthesis, closed-form edge-coupled transmission-line models, and EM analysis using the AWR Microwave Office ® circuit simulator within Cadence ® AWR Design Environment ® software. A miniature X-band, edge-coupled microstrip bandpass filter design example demonstrates this flow. The filter was imple- mented using edge-coupled microstrip lines on a Rogers RO4003 substrate material with Er = 3.66 and H = 8 mil. The temperature coefficient of dielectric constant was among the lowest of any circuit board material, and the dielectric constant was stable over a broad frequency range, specifically at X-band frequencies. The simulated results showed good filter response characteristics with the passband insertion loss approximately 5 dB and return loss greater than 12 dB over the pass bandwidth of 900 MHz. DATASHEET PCB Design Leveraging RF/Microwave Expertise In Cadence AWR Software RF/Microwave IP Integration RF/microwave designers use schematic capture to place active and passive components within a network. Unlike analog and digital designs, which use parasitic extraction after layout, these designs typically include closed-form transmission line models (such as microstrip and stripline) explicitly in the schematic to account for RF behavior much earlier in the design process. Electromagnetic (EM) analysis is also used to characterize structures and validate the overall design. In this way, the electrical and physical designs are concurrently implemented. The AWR Design Environment provides the platform for RF/microwave design entry, circuit/system/EM analysis, and optimization. The result is an electrical design with the layout and PCB stackup information necessary to ensure accurate prediction of the manufactured device's performance. Transferring this layout and stackup information into the Cadence PCB layout and routing platform eliminates the need for manual design re-entry, thus saving time, costs, and the potential for errors. Features f Linear/nonlinear frequency-domain simulation for RF/microwave circuit design f Schematic-driven RF-aware design with integrated EM extraction technology f Parametric studies with optimization, tuning, and yield analysis Benefits f Reduce design time with a comprehensive workflow that supports data exchange between RF/microwave and PCB design tools f Maximize engineering productivity with design automation and a user-friendly interface for engineers of all skill levels f Eliminate costly design respins through accurate design verification Designers face multiple challenges when incorporating RF/microwave, analog, and digital design elements together on the same printed circuit board (PCB). These multi-layer PCBs, which are commonly used in next-generation commercial and military applications, are densely populated with high-speed data lines and RF circuitry and are prone to coupling/ crosstalk and other parasitic behavior that can impair system performance. To successfully integrate RF/microwave content and mixed-signal designs, PCB layout tools and RF circuit design software must exchange design data efficiently. Cadence ® AWR Design Environment ® software offers an RF/microwave intellectual property (IP) creation platform with import and export functionality to provide a pathway to and from Cadence Allegro or OrCAD PCB design tools. RESOURCE SPOTLIGHT 8 www.cadence.com/go/awr

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