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Page
High Impedance Input Stage 344
Other OpAmp Stages 346
Hardware Realisation 348
Amplifier Protection 349
Low Noise Designs using Operational Amplifiers 351
Example 10.2: Amplifier Design for Noise Performance 297
Oscillator using Operational Amplifiers 357
Limitation of Simulations 362
References 363
Chapter 11: Circuit Manufacture 364
Introduction 364
Subtractive Process: Conductive Track Removal 364
Additive Process: Depositing Tracks and Vias 364
Printed Circuit Board Materials 365
Conventional PCB Substrates 365
Paper and Resin Substrates; FR2 and FR3 365
Fibreglass and Epoxy Substrates; FR4, FR408, IS400 366
Microwave and RF Printed Circuit Board Materials 367
RT/duroid 367
RO3000 and RO3200 (PTFE/Ceramic Laminates) 368
RO4000 368
Other Laminates 369
Multilayer Boards 369
Non-Clad Substrates 370
Alumina Substrates 370
Other Substrates 371
Manufacturing 371
Layout Hints 371
Etching 372
Manufacturing using a PCB Milling Machine 373
Manufacturing using Laser Ablation 373
Thin Film 373
Thick Film 375
Printing Screens 375
Pastes (Inks) 376
RF Applications of Thick Film Circuits 377
Manufacturing using 3D printing 377
Low Temperature Cofired Ceramic (LTCC) 379
MMIC Fabrication 380
References 382
Appendix 1: Importing Local Vendor and XML Libraries 385
Local Vendor Libraries 385
Importing Spice Device Models 386
References 388
RF Electronics: Design and Simulation
VIII www.cadence.com/go/awr
