RF Electronics Chapter 11: Circuit Manufacture Page 382
2022, C. J. Kikkert, James Cook University, ISBN 978-0-6486803-9-0.
Figure 11.16. GaN MMIC amplifier chip, [51]
References
1. Isola Group, http://www.isola-group.com/
2. Rogers Corporation, http://www.rogerscorporation.com/
3. AGC Multi Material, https://www.agc-multimaterial.com
4. Rorgers Corporation RT/duroid laminates, https://rogerscorp.com/advanced-
electronics-solutions/rt-duroid-laminates
5. Panasonic Industry Circuit Board Materials,
https://industrial.panasonic.com/ww/products/pt/megtron/megtron6
6. CoorsTek products: Ceramic Substrates, http://www.coorstek.com/resource-
library/library/8510-1083_polished_substrates.pdf
7. Morgan Technical Ceramics, Technical Ceramics Products
http://www.morgantechnicalceramics.com
8. Bechtold, F. "A Comprehensive Overview on Today's Ceramic Substrate
Technologies", European Microelectronics and Packaging Conference, 2009.
EMPC 2009. Rimini, Italy, 15-18 June 2009.
9. Rogers Corporation Ceramic Substrate, https://rogerscorp.com/advanced-
electronics-solutions/curamik-ceramic-substrates
10. Miteq, Dielectric Resonator Oscillators. https://nardamiteq.com/docs/D210B.PDF
11. General Electronic Devices, Dielectric Resonator Oscillators,
http://www.gedlm.com/DRO/DRO.asp
12. Altium http://www.altium.com/
RF Electronics: Design and Simulation
382 www.cadence.com/go/awr
