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RF Electronics: Design and Simulation

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RF Electronics Chapter 11: Circuit Manufacture Page 382 2022, C. J. Kikkert, James Cook University, ISBN 978-0-6486803-9-0. Figure 11.16. GaN MMIC amplifier chip, [51] References 1. Isola Group, http://www.isola-group.com/ 2. Rogers Corporation, http://www.rogerscorporation.com/ 3. AGC Multi Material, https://www.agc-multimaterial.com 4. Rorgers Corporation RT/duroid laminates, https://rogerscorp.com/advanced- electronics-solutions/rt-duroid-laminates 5. Panasonic Industry Circuit Board Materials, https://industrial.panasonic.com/ww/products/pt/megtron/megtron6 6. CoorsTek products: Ceramic Substrates, http://www.coorstek.com/resource- library/library/8510-1083_polished_substrates.pdf 7. Morgan Technical Ceramics, Technical Ceramics Products http://www.morgantechnicalceramics.com 8. Bechtold, F. "A Comprehensive Overview on Today's Ceramic Substrate Technologies", European Microelectronics and Packaging Conference, 2009. EMPC 2009. Rimini, Italy, 15-18 June 2009. 9. Rogers Corporation Ceramic Substrate, https://rogerscorp.com/advanced- electronics-solutions/curamik-ceramic-substrates 10. Miteq, Dielectric Resonator Oscillators. https://nardamiteq.com/docs/D210B.PDF 11. General Electronic Devices, Dielectric Resonator Oscillators, http://www.gedlm.com/DRO/DRO.asp 12. Altium http://www.altium.com/ RF Electronics: Design and Simulation 382 www.cadence.com/go/awr

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