Issue link: https://resources.system-analysis.cadence.com/i/1269074
AWR Microwave Office 3 www.cadence.com/go/awr Applications and Technologies MMIC The front-to-back monolithic microwave integrated circuit (MMIC) design flow with an innovative user interface and complete integration of design entry, simulation, and physical design tools enhances engineering productivity and ensures first-pass success with PDKs from a wide range of gallium arsenide (GaAs), gallium nitride (GaN), silicon germanium (SiGe), and CMOS foundry partners. The hierarchical framework supports simulation of diverse MMIC, RFIC, and PCB processes, multi-layer interconnects, embedded passives, and surface-mounted mini-devices found within multi-chip RF modules. PCB Accurate modeling of transmission media from the RF signal path to digital control and DC bias lines supports increasing functionality of PCBs. Circuit/system and EM co-simulation provide complete analysis of surface-mount components, interconnecting transmission lines, and embedded and distributed passive elements, as well as EM verification. The integrated platform supports concurrent electrical/physical design and circuit/system/EM co-simu- lation to minimize reliance on disparate point tools. RF-aware PCB design with EM co-simulation provides enhanced accuracy and greater fast-pass success. Module Multi-technology integration models the behavior of many different technologies and the hierarchical framework supports simulation of diverse MMIC, RFIC, and PCB processes, multi-layer interconnects, embedded passives, and surface-mounted mini-devices found within multi-chip RF modules. Design automation accelerates product devel- opment with smart workflows for module realization. EM-enabled parasitic extraction and design verification provide enhanced accuracy and greater fast-pass success. The integrated platform supports concurrent electrical and physical design, as well as circuit, system, and EM co-simu- lation to minimize reliance on multiple point tools.